We specialize in 3D wafer stacking and TSV processes, cutting edge memory products, and wide-ranging collaborations.
In 2004 Tezzaron® demonstrated the world's first successful wafer-stacked 3D-ICs with TSV, including microprocessors, sensors, and SRAM devices. Since that time the company has worked with dozens of customers to create custom 3D-ICs for prototyping and commercialization.
We have a truly excellent team on board -- and a few openings. Are you the engineer we're looking for?