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The Leader in 3D IC Technology

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TECHNOLOGIES

Tezzaron - The Very Best in 3D ICs

 

FaStack®
   3D Wafer Stacking

 

3T-iRAM®
   Fast Memory Cells

 

Bi-STAR®
   Self-Test and Repair

 

3D-IC Industry Summary

 

Related Papers and Presentations

 

A Response to Intel's 3D Transistor
Announcement (May 4, 2011)

PRODUCTS

World's First 3D Processor

Working Prototype, 2004

Custom 3D-IC Projects

Multi-Project Wafers

Full Customization

Standalone Memories

DRAM

SRAM Replacement

3D Stackable Memories

 

Standalone Microcontroller with SRAM

 

 

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INVESTORS

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Copyright © 2005-2011 Tezzaron® Semiconductor. All rights reserved.  Revised: January 25, 2012
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