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3D-IC Microcontroller Prototype

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FaStack® RISC Microcontroller Prototype

World's first 3D-IC processor
Up to 90% power reduction
Industry standard 8051 / 8031 software compatible
RISC architecture with up to x12 speed advantage / MHz over traditional 8051 family devices
Four speed grades: 100, 150, 180, and 200 MHz
128KB of additional high-speed FaStack® SRAM memory
IEEE 754-compliant floating point coprocessor for full arithmetic capabilities - up to 100 MFlops
Extended 32-bit computing functions including population counter, leading zero counter, and floating-point comparator
Dual data pointers for fast data block moves
Up to 200 MIPS and 100 MFlops
Full 8051-compatible architecture including:

* Four 8-bit bi-directional ports
* 256 Bytes of "Scratch Pad" memory
* Three 16-bit timer/counters
* Interrupt controller with 12 interrupt sources and 4 priority levels
* 15-bit programmable watchdog timer
* Core 8-bit arithmetic logic unit and 16-bit multiplication division unit
* Two full-duplex serial ports
* Four capture/compare units to generate pulse width modulated signals
* Special Function Register (SFR) interface, serving up to 50 SFR devices

Tezzaron Semiconductor's prototype microcontroller features a layer of stacked integrated SRAM for additional Data and Program memory.  The 8-bit microcontroller runs at clock speeds of up to 200 MHz.  It executes all ASM51 instructions and uses the same instruction set as the 8031, using a Reduced Instruction Set Computer (RISC) core so that many of its instructions are executed in a single clock cycle.  This provides a significant speed advantage over traditional 8051 devices that execute an instruction every twelve clock cycles.   It also features extended 32-bit capabilities including an IEEE 754-compliant floating-point coprocessor with comparator, a multiply/divide unit, a population counter, and a leading-zero counter.

This fully functional prototype has been demonstrated at conferences around the world since its creation in 2004.  Tezzaron's patented FaStack® wafer stacking technology was used to bond 128 KB of high-speed SRAM layer over the processor.  The successful creation of this revolutionary 3D-IC confirmed the potential of FaStack technology for new generations of cutting-edge devices.

This processor is supported by Keil® Software.

For more about Keil® software:

Related pages:

bulletDemonstration Video
bulletPhotos
bulletFaStack® Technology
bulletPress:
Tezzaron applies 3D stacking technology to 8051 MCU core (Embedded.com, 22 May 2005)
Tezzaron Chooses CAST IP Core for First Ever Stacked 3D IC Processor (PR Newswire, 18 May 2005)
Six 3D designs precede 90% power-saving claims from Tezzaron (Wall Street & Technology, 23 December 2004)
Tezzaron debuts 'super-8051' chip with 3D technology (Silicon Strategies, 6 December 2004)
Third Dimension Triples Processor Speed (Press Release, 6 December 2004)
Tezzaron Announces Commercial 3D ICs (Press Release, 14 April 2004)
Copyright © 2004-2009 Tezzaron® Semiconductor.  All rights reserved.  Revised: May 12, 2011
 

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