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World's first 3D-IC processor |
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Up to 90% power reduction |
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Industry standard 8051 / 8031 software compatible |
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RISC architecture with up to x12 speed advantage / MHz over traditional 8051 family
devices |
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Four speed grades: 100, 150, 180, and 200 MHz |
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128KB of additional high-speed FaStack® SRAM memory |
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IEEE 754-compliant floating point coprocessor for full arithmetic capabilities - up to 100
MFlops |
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Extended 32-bit computing functions including population counter, leading zero counter, and
floating-point comparator |
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Dual data pointers for fast data block moves |
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Up to 200 MIPS and 100 MFlops |
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Full 8051-compatible architecture including: |
* Four 8-bit bi-directional ports
* 256 Bytes of "Scratch Pad" memory
* Three 16-bit timer/counters
* Interrupt controller with 12 interrupt sources and 4 priority levels
* 15-bit programmable watchdog timer
* Core 8-bit arithmetic logic unit and 16-bit multiplication division unit
* Two full-duplex serial ports
* Four capture/compare units to generate pulse width modulated signals
* Special Function Register (SFR) interface, serving up to 50 SFR devices
Tezzaron Semiconductor's prototype microcontroller features a layer of stacked integrated
SRAM for additional Data and Program memory. The 8-bit
microcontroller runs at
clock speeds of up to 200 MHz. It executes
all ASM51 instructions and uses the same instruction set as the 8031,
using a Reduced Instruction Set Computer (RISC) core so that many of its
instructions are executed in a single clock cycle. This provides a significant speed advantage
over traditional 8051 devices that execute an instruction every twelve clock
cycles. It also features extended 32-bit capabilities including an IEEE 754-compliant
floating-point coprocessor with comparator, a multiply/divide unit, a population counter, and
a leading-zero counter.
This fully functional prototype has been demonstrated at conferences
around the world since its creation in 2004. Tezzaron's patented FaStack® wafer stacking technology
was used to bond 128 KB of high-speed SRAM layer over the processor.
The successful creation of this revolutionary 3D-IC confirmed the
potential of FaStack technology for new generations of cutting-edge
devices.
This processor is supported by Keil® Software.