3D-IC Microprocessor Prototype:
two-layer 3D- IC with vertical interconnections was built using Tezzaron's FaStackô process.
One layer of the chip contains an 8051-style
processor, the other contains SRAM memory. The chip used here was
built in 2004.
The demonstration device contains the Tezzaron 3D-IC prototype and another fast 8051 processor - the Dallas
DS89C420. Each processor runs at its top speed, executing a program that repeatedly calculates and
displays a Mandelbrot fractal image. The image colors change with each iteration.
The two images
share a single monitor, with the 3D-IC image on the upper half and the other processor's
image on the lower half.
The video was filmed during a live demonstration and then compressed to run six times faster
than realtime. The demonstration clearly shows the speed advantage of the
completes three full images while the other processor completes about half of one image.