The bottom layer of the stack contains circuitry for an 8051-style processor.
August, 2004 - before stacking:
The upper layer of the stack contains SRAM memory circuits.
November, 2004 - after stacking:
This is the lower left corner of the bare chip - a highly magnified view (actual size 4mm
x 4mm). The surface is quite blank because all the circuitry is inside the stack.
Here the chip is mounted in its test package. The protective cover was held open for this
photo with a bit of tape.
A demo board was designed specifically to showcase the new processor, which is under the
yellow square to the left of center in this photo.
The demo generates complex "mandelbrot" patterns, running head-to-head with a
standard 8051-type processor. The Tezzaron processor generates patterns about 3 times faster
than the standard processor. This photo shows the demo being run at the CAST booth of the 2005
DAC show in California.