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Tezzaron's 3T-iRAM® technology was prototyped under the name PSiRAM™. The very first
prototypes were designed in December of 2002; the finished prototype parts were received in July of 2003.
Click on any picture to see a larger image
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July, 2003
This uncut 8" wafer, built at a 90-nanometer scale, contains hundreds of
chips.
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July, 2003
Microscopic
view of one PSiRAM™ prototype chip (uncut). |
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July, 2003
Ultra-close-up
of one corner of an uncut chip.
(Each bright square is 60 microns wide.) |
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August, 2003
Prototype chip, cut and packaged. |
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August, 2003
The PSiRAM™
prototype design team:
Bob Patti, Rick Gawron, Mark Hilbert,
Lee Hoyman, Rob McGrath, Kamal El Khadiri |
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 | For more about 3T-iRAM® technology, click here. |
Copyright © 2003-2005 Tezzaron® Semiconductor. All rights reserved. Revised:
July 30, 2008
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