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Both micrographs show a cross-section of a three-wafer stack connected with copper
Super-Vias. In both photos, the bottom wafer is face up, with silicon on the bottom and copper
bondpoints on the top; the upper two wafers are face down (silicon on the top).
Click on either picture to see a larger image
| June, 2003
Three Super-Via™ connections are visible here - the leftmost connection pierces the top two
wafers; the middle connection pierces all three wafers; the rightmost connection pierces only
the bottom wafer. |
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| June, 2003
Five Super-Via™ connections are visible here – two pierce only the top wafer, two pierce
the bottom, and the rightmost pierces all three wafers. |
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Copyright © 2003-2009 Tezzaron® Semiconductor. All rights reserved. Revised:
May 12, 2011
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