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Both micrographs show a cross-section of a three-wafer stack connected with
copper Super-Vias. In both photos, the bottom wafer is face up, with silicon on the
bottom and copper pads on the top; the upper two wafers are face down (silicon
on the top).
Click on either picture to see a larger image
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June, 2003
Three Super-Via™ connections are visible here - the leftmost connection
pierces the top two wafers; the middle connection pierces all three wafers; the
rightmost connection pierces only the bottom wafer.
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June, 2003
Five
Super-Via™ connections are visible here – two pierce only the top
wafer, two pierce the bottom, and the rightmost pierces all three
wafers. |
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 | For more about wafer stacking technology, click here. |
Copyright © 2003-2005 Tezzaron® Semiconductor. All rights reserved. Revised:
January 10, 2008
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