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TIPP 2011 Chicago

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The 2011 Technology and Instrumentation in Particle Physics (TIPP) was held in Chicago, Illinois.  Tezzaron's CTO presented "3D-IC for real chips and prospectives" at the 3D-IC Satellite Meeting

All pictures were provided by Ted Liu of Fermilab
Click on any picture to see a larger image

June 2011
Delivering "3D-IC for real chips and prospectives"

 DSC_2481a.jpg (23916 bytes)

June 2011
Delivering "3D-IC for real chips and prospectives"

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June 2011
Displaying a TSV-enabled wafer		 DSC_2485a.jpg (17646 bytes)
June 2011
Networking at the TIPP 3D-IC Satellite Meeting		 DSC_2475a.jpg (27969 bytes)
June 2011
Networking at the TIPP 3D-IC Satellite Meeting		 DSC_2476a.jpg (29027 bytes)
June 2011
Bob Patti (left) with Ray Yarema of Fermilab		 DSC_2500a.jpg (21458 bytes)
June 2011
Organizers of the TIPP 3D-IC Satellite Meeting		 DSC_2507a.jpg (23810 bytes)
 
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Copyright © 2011 Tezzaron® Semiconductor. All rights reserved.  Revised: September 26, 2011
 

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