Tezzaron Moves to Provide 3-D Chips, Stacks, Services
New Facility Allows Manufacturing, Growth

Naperville, IL – July 24, 2003

Tezzaron Semiconductor, an innovator in wafer stacking technology, has relocated its Singapore subsidiary to a larger facility as it moves toward early production of stacked components. Tezzaron’s subsidiary (Tachyon Semiconductor (Singapore) Pte. Ltd.) announced its latest technological achievement in June – an electrically interconnected four-wafer stack.  The new lab and manufacturing facility includes access to advanced copper processing facilities, bringing Tezzaron one step closer to realization of a fully integrated 3-D SoC (System on Chip).

The move to the new facility allows Tezzaron to take on immediate customer opportunities in both turnkey 3-D development services and wafer stacking contract services while continuing to press forward on its own product line.  Discussions with a number of early customers are already underway.

Tezzaron’s subsidiary previously occupied offices in Singapore’s Institute of Microelectronics (IME), where its achievements in wafer stacking led IME to publicize Tachyon as an “incubation success story.”  The new facility is leased from MicroFab Technology, a production foundry in Singapore.

Tachyon Semiconductor (Singapore) Pte. Ltd. is a wholly owned subsidiary of Tezzaron Semiconductor (Naperville, Illinois).  For more information on both companies, go to: www.tezzaron.com or send email to: info@tezzaron.com .

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