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Tezzaron® in the News

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Newspaper and industry articles on Tezzaron® are listed in reverse chronological order.
See also: Related Papers and Presentations
Date Headline
2 April 2013 Memory vendors pile on '3D' stacking standard
(The Register)
March/April 2013 Interposers: What’s Different This Time Around?
(Chip Scale Review - see page 11)
21 Mar 2013 How making microchips 3D could unleash an age of “cognitive computing”
(Quartz)
7 Mar 2013 Viewing 3D IC Blossoms at SPIE Advanced Lithography 2013
(3D InCites)
24 Jan 2013 Stacked Die From A Networking Angle
(Semiconductor Manufacturing and Design)
16 Jan 2013 Novati Technologies Licenses Ziptronix's Patented Technologies
(Joint press release, BusinessWire) picked up by DigiMars, EDACafe, EE Times, FreshNews.com, Global Techwire, HeraldOnline, i-Micronews, Individual.com, iStockAnalyst, Marketwatch, Nanotechnology Now, Solid State Technology, Street Insider, TD Waterhouse, Triangle Business Journal, WRALtechwire, Yahoo!Finance, etc.
1 Jan 2013 Singapore IME launches 2.5D silicon interposer MPW
(Solid State Technology)
30 Dec 2012 RTI 3D ASIP Part I
(Insights from the Leading Edge)
19 Dec 2012 A*STAR’s Institute of MicroElectronics Launches 2.5D Silicon Interposer Multi-Project Wafer Offering on 300mm Technology Platform
(IME Press Release) picked up by BioSpace, EuroAsia Industry, Solid State Technology,
14 Dec 2012 3D IC Pioneers Continue to Lead the Way
(3D InCites)
13 Dec 2012 Foundry Landscape Changes In 3D and
Welcome To The ‘Probably Good Die’ Era

(Semiconductor Manufacturing & Design)
12 Dec 2012 Ziptronix Licenses Direct Bond Interconnect (DBI®) and ZiBond® Patented Technologies to Tezzaron Semiconductor for Advanced 3D Memory and 3D Integrated Assemblies
(Joint Press Release, Business Wire) picked up by Chip Estimate, CIE, Display +, EDA Cafe, Electronics Feed, Fort Mill Times, High Beam, i-Micronews, Market Watch, Nanotechnology Now, News Blaze, Silian, Silicon Semiconductor, SOC Central, Solid State Technology, Vancouver Sun, Yahoo Finance, etc.
26 Nov 2012 The Multiple Uses of Interposer Layers
(FPGA Gurus blog)
21 Nov 2012 “Known Good Die” has a new name
(3D InCites)
20 Nov 2012 Countdown to 3D Architectures for Semiconductor Integration and Packaging
(3D InCites)
11 Nov 2012 Huawei, Altera mix FPGA, memory in 2.5-D device
(EE Times) picked up by many Chinese publications
5 Nov 2012 Tezzaron, Novati and 3D ICs: They’re doing it in the USA
(3D InCites)
26 Oct 2012 The new dimension in chip design
(Electronics News)
22 Oct 2012 Tezzaron Semiconductor Completes Acquisition of SVTC's Austin Fab, Now Novati Technologies
(Joint Press Release) picked up by Aerospace Journal, AndhraNews, Before It's News, Bloomberg Business Week, Business Press, Contacto Latino, einNews, iStockAnalyst, Live-PR, MarketWatch, News Blaze, Robotics Wire, SOCcentral, Solid State Technology, Strategic News Service, Street Insider, Ulitzer, Yahoo! Finance, etc.

Former SVTC Austin facility to operate as Novati Technologies
(Austin Business Journal) picked up by Big News Network, I4U News

Tezzaron Semi with new Austin Fab
(ElectronicsFeed)

12 Oct 2012 Tezzaron Saves Austin Research Fab
(Commercial Property Executive)
11 Oct 2012 Electronics in an extra dimension
(Symmetry)

Tezzaron's Austin fab rescue saves jobs and more
(Google vs Apple)
8 Oct 2012 Tezzaron Semi rescues fab critical to DoD
(EE Times) picked up by Austin Local Me
7 Oct 2012 Tezzaron acquires Texas SVTC facility
(Insights From the Leading Edge)
4 Oct 2012 A Smorgasbord of 3D News
(3D InCites)
2 Oct. 2012 Tezzaron acquires Texas Semiconductor facility to assemble its 3DIC devices
(i-Micronews)
1 Oct. 2012 Press release: Tezzaron Acquires Texas Semiconductor Facility
picked up by 3D Incites, Controlled Environments; mentioned in Semi MD

Last-minute deal saves Austin chip fab
and
Austin research fab saved by new owner
(Statesman.com) also picked up as a Story of the Week

Tezzaron buys Austin facility slated for closure, lay offs
(Austin Business Journal) picked up by Topix, Loku, I4U News, Big News Network

Tezzaron takes over SVTC's Austin fab amid layoff reports
(Solid State Technology - marked as "Editor's Choice") picked up by Trusted Foundry

Sept. 2012 Chips Go Upscale
(Communications of the ACM)
5 Sept. 2012 3D Thursday: Produce cost-effective 2.5D and 3D devices
(EDA360 Insider)
31 July 2012 Litho Community Meets And Votes
(Semiconductor Mfg. & Design blog)
31 July 2012 The Changing Role Of The OSAT
(Semiconductor Mfg. & Design blog)
24 July 2012 Reliance on radiation-hardened and radiation-tolerant components
(Avionics Intelligence)
21 July 2012 Tezzaron Semiconductor Assigned Patent
(TMCnet.com)
12 July 2012 Want some real-world insight into 2.5D and 3D IC design and assembly? Read on to get the word from Tezzaron Semiconductor
(EDA 360 Insider)
12 July 2012 Architectural Changes Will Drive Miraculous 3D Gains
(Chip Design blog)
12 July 2012 Testing the Waters
(Chip Design blog)
12 July 2012 Bubble Gum and Scotch Tape
(Chip Design blog)
11 June 2012 1,000,000,000,000 Transistor IC Layout Editing at DAC
(SemiWiki.com)
6 June 2012 Training the Next Gen for Low Power
(Chip Design blog)
4 June 2012 IMAPS DPC Part II
(Insights form the Leading Edge)
26 May 2012 Tezzaron Semiconductor Assigned Patent
(Targeted News Service press release)
18 May 2012 3D IC 2-tier 16PE Multiprocessor with 3D NoC Architecture Based on Tezzaron Technology
(Design & Reuse)
13 May 2012 3D chip stack
(China IC News)
1 May 2012 3D-IC Challenges Addressed at SEMICON Singapore
(SEMI)
13 April 2012 3D-MAPS multicore processor: A closer look
(i-Micronews)
March 2012 Tezzaron at the 3D Summer School, February 6-8, in Buenos Aires:
Los chips del futuro ya se diseñan en la Argentina (Agencia Cyta)
Expertos de la Universidad Nacional del Sur arman un chip con tecnología 3D. (aptus) 
Científicos argentinos arman un chip con tecnología 3D and
Cientistas argentinos armam um chip com tecnologia 3D (universia)
Diseñan chips 3D en Argentina (Argentina.ar)
En Argentina se están diseñando chips futuristas (Informe Victoria)
17 March 2012 2.5 / 3D at the 2012 IEEE ISSCC
(Solid State Technology)
1 March 2012 The incredible shrinking pixel sensor
(ILC newsline)
13 February 2012 Challenges, opportunities of the 2.5D/3D ecosystem
(EE Times Asia)
January, 2012 3D IC Technology: Adoption and Commercialization
(GSA Forum, see page 17)
28 December 2011 Is 3D IC Packaging Ready For Prime Time?
and
A Host Of 3D IC Collaborations And Standardization Efforts Emerging

(Electronic Design)
20 December 2011 Bob Patti, Tezzaron Semiconductor, at the RTI 3D Architectures for Semiconductor Integration and Packaging 2011 (video)
(3D InCites)
9 December 2011 Honeywell and Tezzaron to Build Rad Hard 3D-ICs
(Tezzaron and Honeywell joint press release) picked up by 3D Design China, 3D-ICs, 3D InCites, Advanced Packaging, Aviation Forum(1), Aviation Forum(2), CANnews, DEDE CMS, DSTI.NET(1), DSTI.NET(2), ECN, SOHU.com, Trusted Foundry

Reported as "Honeywell taps Tezzaron Semiconductor to stack rad-hard die" (ElectroIQ)
and "Rad-hard 3D integrated circuit design for aerospace and defense is goal of Honeywell-Tezzaron partnership" (Military & Aerospace Electronics)
and "Honeywell, Tezzaron Semi partner to develop 3D chips for military/aero applications" (Smart Brief)

6 December 2011 A*STAR and Tezzaron Team Up to Develop 2.5D/3D Technology
(Tezzaron and IME joint press release) picked up by 3D-ICs, 3D InCites, ACN newswire, Ad Hoc News, AndhraNews, Asia Research News, Benzinga, BioSpace, BizWire Express, Business News Asia, Chip Scale Review, ClinicaSpace, Cloud Computing, DeviceSpace, Digital Journal, ecplaza, EDACafe, EE Times Asia, ifeng, EFY Times, EuroInvestor, FinanzNachrichten, Global SMT&Pkg, i-Micronews, ITnews, IT News Online, JCNnetwork, MarketWatch, Nanowerk, News Blaze, PCB007, PCB Design 007, pr-inside, Quamnet, redOrbit, ResearchSEA, Scoopasia, SG Press Centre, Smart Group, SMT, StreetInsider, TheAsiaBIZZ, TMCnet(1), TMCnet(2), Topix, Tuwala, World'Vest Base, WVB Global, Yahoo Finance

Reported as "IME, Tezzaron develop "2.5D" interposer tech" (EE Times Asia)
and "Silicon interposer partnership sets roadmap" (ElectroIQ)
and "Singapore duo to streamline interposer production" (ElectronicsWeekly)

25 November 2011 3D stack design: a tale from the frontline
(ElectronicsWeekly.com)
21 November 2011 Building 3D-ICs: Tool Flow and Design Software (part 2 of 2)
(EE Times) (also in EE Times Asia and SOCcentral)
17 November 2011 Liquid could power and cool mobile supercomputers
(New Scientist, via Electronics Weekly)
14 November 2011 Building 3D-ICs: Tool Flow and Design Software (part 1 of 2)
(EE Times) (also in EE Times Asia and Design & Reuse)
October 2011 Biting Into the New Silicon Sandwich
(EE Times Confidential)
11 October 2011 Perfecting the 3-D chip
(EE Times)
20 September 2011 3-D IC panel – CICC
(Media and Entertainment Technologies)
22 July 2011 Thin Film Polymer Apps from the 2011 ECTC; Tezzaron 3D Activity
(Insights From the Leading Edge)
22 July 2011 Ten Custom 3D-ICs from Tezzaron
(Tezzaron press release)
9 July 2011 Elpida and MOSIS Ready for 3D IC ; TSV Going “Where the Sun Don’t Shine”
(Insights From the Leading Edge)
16 June 2011 Invited Talk at the 3D satellite workshop at the TIPP2011
(MonolithIC blog)
9 June 2011 EDA tools pave path to 3-D ICs
(EDN)
3 June 2011 Mentor Graphics Works With Tezzaron and MOSIS on 3D-IC Prototyping Service
(Mentor press release) picked up by 4Traders, Ad Hoc News, AlphaTrade Finance, Bradenton, Business Wire, Centre Daily Times, Chip Estimate, Congoo, EDA Café, EE Herald, ElectroIQ, Elektronik Informationen, Finanzen, FinanzNachrichten, FreshNews, Global Print Monitor, GNT, Green Technology World, iStockAnalyst, Live-PR, Morningstar, NewsBlaze, PC's Semiconductors Blog, Reuters, Seeking Alpha, Sensors, StreetInsider, Sys-Con, The Street, TMC, Traders Huddle, Virtual-Strategy, Web2.0 Journal, WebWire, Welt Online, World News Network, Yahoo!Finance,  and other news sites and blogs.
14 April 2011 Tezzaron Reports Outstanding 3D Success at ISPD
(MonolithIC 3D)
13 April 2011 ISPD spots 3-D, maskless-lithography trends
(EE Times)
18 February 2011 Micron reveals “Hyper Memory Cube” 3DIC Technology
(i-Micronews)
29 January 2011 3D Highlights at the RTI 3D ASIP Part 1
(Insights From the Leading Edge)
3 January 2011 Outlook and Trends 2011: A Perspective
(SMT Magazine)
For earlier articles:
bulletTezzaron in the News, 2009 and 2010
bulletTezzaron in the News, 2007 and 2008
bulletTezzaron in the News, 2005 and 2006
bulletTezzaron in the News, 2003 and 2004
bulletTezzaron in the News, 2001 and 2002

See also: Related Papers and Presentations

Copyright © 2007-2013 Tezzaron® Semiconductor. All rights reserved.  Revised: April 09, 2013
 

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