Newspaper and industry articles on Tezzaron® are listed in reverse chronological order.
See also: Related Papers and Presentations
|
| Date |
Headline |
| 2 April 2013 |
Memory
vendors pile on '3D' stacking standard
(The Register) |
| March/April 2013 |
Interposers:
What’s Different This Time Around?
(Chip Scale Review - see page 11) |
| 21 Mar 2013 |
How
making microchips 3D could unleash an age of “cognitive computing”
(Quartz) |
| 7 Mar 2013 |
Viewing
3D IC Blossoms at SPIE Advanced Lithography 2013
(3D InCites) |
| 24 Jan 2013 |
Stacked
Die From A Networking Angle
(Semiconductor Manufacturing and Design) |
| 16 Jan 2013 |
Novati
Technologies Licenses Ziptronix's Patented Technologies
(Joint press release,
BusinessWire) picked up by
DigiMars,
EDACafe,
EE
Times,
FreshNews.com,
Global
Techwire, HeraldOnline,
i-Micronews,
Individual.com,
iStockAnalyst,
Marketwatch,
Nanotechnology
Now, Solid
State Technology, Street
Insider,
TD
Waterhouse,
Triangle Business
Journal,
WRALtechwire,
Yahoo!Finance,
etc. |
| 1 Jan 2013 |
Singapore
IME launches 2.5D silicon interposer MPW
(Solid State Technology) |
| 30 Dec 2012 |
RTI
3D ASIP Part I
(Insights from the Leading Edge) |
| 19 Dec 2012 |
A*STAR’s
Institute of MicroElectronics Launches 2.5D Silicon Interposer
Multi-Project Wafer Offering on 300mm Technology Platform
(IME Press Release) picked up by BioSpace,
EuroAsia
Industry, Solid
State Technology, |
| 14 Dec 2012 |
3D
IC Pioneers Continue to Lead the Way
(3D InCites) |
| 13 Dec 2012 |
Foundry
Landscape Changes In 3D and
Welcome
To The ‘Probably Good Die’ Era
(Semiconductor Manufacturing & Design) |
| 12 Dec 2012 |
Ziptronix
Licenses Direct Bond Interconnect (DBI®) and ZiBond® Patented
Technologies to Tezzaron Semiconductor for Advanced 3D Memory and 3D Integrated
Assemblies
(Joint Press Release, Business
Wire) picked up by Chip
Estimate, CIE,
Display
+, EDA
Cafe, Electronics Feed,
Fort
Mill Times, High
Beam, i-Micronews,
Market
Watch, Nanotechnology
Now, News
Blaze, Silian,
Silicon
Semiconductor, SOC
Central, Solid
State Technology, Vancouver
Sun, Yahoo
Finance, etc. |
| 26 Nov 2012 |
The
Multiple Uses of Interposer Layers
(FPGA Gurus blog) |
| 21 Nov 2012 |
“Known
Good Die” has a new name
(3D InCites) |
| 20 Nov 2012 |
Countdown
to 3D Architectures for Semiconductor Integration and Packaging
(3D InCites) |
| 11 Nov 2012 |
Huawei,
Altera mix FPGA, memory in 2.5-D device
(EE Times) picked up by many Chinese publications |
| 5 Nov 2012 |
Tezzaron,
Novati and 3D ICs: They’re doing it in the USA
(3D InCites) |
| 26 Oct 2012 |
The
new dimension in chip design
(Electronics News) |
| 22 Oct 2012 |
Tezzaron
Semiconductor Completes Acquisition of SVTC's Austin Fab, Now Novati
Technologies
(Joint Press Release) picked up by Aerospace
Journal, AndhraNews,
Before
It's News, Bloomberg
Business Week, Business
Press, Contacto
Latino, einNews,
iStockAnalyst,
Live-PR,
MarketWatch,
News
Blaze, Robotics
Wire, SOCcentral, Solid
State Technology, Strategic
News Service, Street
Insider, Ulitzer,
Yahoo!
Finance, etc.
Former
SVTC Austin facility to operate as Novati Technologies
(Austin Business Journal) picked up by Big
News Network, I4U
News
Tezzaron Semi with
new Austin Fab
(ElectronicsFeed)
|
| 12 Oct 2012 |
Tezzaron
Saves Austin Research Fab
(Commercial Property Executive) |
| 11 Oct 2012 |
Electronics
in an extra dimension
(Symmetry)
Tezzaron's
Austin fab rescue saves jobs and more
(Google vs Apple)
|
| 8 Oct 2012 |
Tezzaron
Semi rescues fab critical to DoD
(EE Times) picked up by Austin
Local Me |
| 7 Oct 2012 |
Tezzaron
acquires Texas SVTC facility
(Insights From the Leading Edge) |
| 4 Oct 2012 |
A
Smorgasbord of 3D News
(3D InCites) |
| 2 Oct. 2012 |
Tezzaron
acquires Texas Semiconductor facility to assemble its 3DIC devices
(i-Micronews) |
| 1 Oct. 2012 |
Press release: Tezzaron
Acquires Texas Semiconductor Facility
picked up by 3D Incites,
Controlled
Environments; mentioned in Semi
MD
Last-minute
deal saves Austin chip fab
and
Austin
research fab saved by new owner
(Statesman.com) also picked up as a Story
of the Week
Tezzaron
buys Austin facility slated for closure, lay offs
(Austin Business Journal) picked up by Topix,
Loku,
I4U
News, Big
News Network
Tezzaron
takes over SVTC's Austin fab amid layoff reports
(Solid State Technology - marked as "Editor's Choice") picked
up by Trusted
Foundry |
| Sept. 2012 |
Chips
Go Upscale
(Communications of the ACM) |
| 5 Sept. 2012 |
3D
Thursday: Produce cost-effective 2.5D and 3D devices
(EDA360 Insider) |
| 31 July 2012 |
Litho
Community Meets And Votes
(Semiconductor Mfg. & Design blog) |
| 31 July 2012 |
The
Changing Role Of The OSAT
(Semiconductor Mfg. & Design blog) |
| 24 July 2012 |
Reliance
on radiation-hardened and radiation-tolerant components
(Avionics Intelligence) |
| 21 July 2012 |
Tezzaron
Semiconductor Assigned Patent
(TMCnet.com) |
| 12 July 2012 |
Want
some real-world insight into 2.5D and 3D IC design and assembly? Read on
to get the word from Tezzaron Semiconductor
(EDA 360 Insider) |
| 12 July 2012 |
Architectural
Changes Will Drive Miraculous 3D Gains
(Chip Design blog) |
| 12 July 2012 |
Testing
the Waters
(Chip Design blog) |
| 12 July 2012 |
Bubble
Gum and Scotch Tape
(Chip Design blog) |
| 11 June 2012 |
1,000,000,000,000
Transistor IC Layout Editing at DAC
(SemiWiki.com) |
| 6 June 2012 |
Training
the Next Gen for Low Power
(Chip Design blog) |
| 4 June 2012 |
IMAPS
DPC Part II
(Insights form the Leading Edge) |
| 26 May 2012 |
Tezzaron
Semiconductor Assigned Patent
(Targeted News Service press release) |
| 18 May 2012 |
3D
IC 2-tier 16PE Multiprocessor with 3D NoC Architecture Based on Tezzaron
Technology
(Design & Reuse) |
| 13 May 2012 |
3D
chip stack
(China IC News) |
| 1 May 2012 |
3D-IC
Challenges Addressed at SEMICON Singapore
(SEMI) |
| 13 April 2012 |
3D-MAPS
multicore processor: A closer look
(i-Micronews) |
| March 2012 |
Tezzaron at the 3D Summer
School, February 6-8, in Buenos Aires:
Los
chips del futuro ya se diseñan en la Argentina (Agencia Cyta)
Expertos
de la Universidad Nacional del Sur arman un chip con tecnología 3D. (aptus)
Científicos
argentinos arman un chip con tecnología 3D and
Cientistas
argentinos armam um chip com tecnologia 3D (universia)
Diseñan
chips 3D en Argentina (Argentina.ar)
En
Argentina se están diseñando chips futuristas (Informe Victoria) |
| 17 March 2012 |
2.5
/ 3D at the 2012 IEEE ISSCC
(Solid State Technology) |
| 1 March 2012 |
The
incredible shrinking pixel sensor
(ILC newsline) |
| 13 February 2012 |
Challenges,
opportunities of the 2.5D/3D ecosystem
(EE Times Asia) |
| January, 2012 |
3D
IC Technology: Adoption and Commercialization
(GSA Forum, see page 17) |
| 28 December 2011 |
Is
3D IC Packaging Ready For Prime Time?
and
A
Host Of 3D IC Collaborations And Standardization Efforts Emerging
(Electronic Design) |
| 20 December 2011 |
Bob
Patti, Tezzaron Semiconductor, at the RTI 3D Architectures for
Semiconductor Integration and Packaging 2011 (video)
(3D InCites) |
| 9 December 2011 |
Honeywell
and Tezzaron to Build Rad Hard 3D-ICs
(Tezzaron and Honeywell joint press release) picked up by 3D
Design China, 3D-ICs,
3D
InCites, Advanced
Packaging, Aviation
Forum(1), Aviation
Forum(2), CANnews,
DEDE CMS,
DSTI.NET(1),
DSTI.NET(2),
ECN,
SOHU.com, Trusted
Foundry
Reported as "Honeywell
taps Tezzaron Semiconductor to stack rad-hard die" (ElectroIQ)
and "Rad-hard
3D integrated circuit design for aerospace and defense is goal of
Honeywell-Tezzaron partnership" (Military & Aerospace
Electronics)
and "Honeywell,
Tezzaron Semi partner to develop 3D chips for military/aero applications"
(Smart Brief)
|
| 6 December 2011 |
A*STAR
and Tezzaron Team Up to Develop 2.5D/3D Technology
(Tezzaron and IME joint press release)
picked up by 3D-ICs,
3D InCites,
ACN
newswire, Ad
Hoc News, AndhraNews,
Asia
Research News, Benzinga,
BioSpace,
BizWire
Express, Business
News Asia, Chip
Scale Review, ClinicaSpace,
Cloud Computing,
DeviceSpace,
Digital Journal, ecplaza,
EDACafe,
EE
Times Asia, ifeng, EFY
Times, EuroInvestor,
FinanzNachrichten,
Global
SMT&Pkg, i-Micronews,
ITnews,
IT
News Online, JCNnetwork,
MarketWatch,
Nanowerk, News
Blaze, PCB007,
PCB
Design 007, pr-inside,
Quamnet,
redOrbit,
ResearchSEA,
Scoopasia,
SG
Press Centre, Smart
Group, SMT,
StreetInsider,
TheAsiaBIZZ,
TMCnet(1),
TMCnet(2),
Topix,
Tuwala,
World'Vest Base,
WVB Global,
Yahoo
Finance
Reported as "IME,
Tezzaron develop "2.5D" interposer tech" (EE Times
Asia)
and "Silicon
interposer partnership sets roadmap" (ElectroIQ)
and "Singapore
duo to streamline interposer production" (ElectronicsWeekly)
|
| 25 November 2011 |
3D
stack design: a tale from the frontline
(ElectronicsWeekly.com) |
| 21 November 2011 |
Building
3D-ICs: Tool Flow and Design Software (part 2 of 2)
(EE Times) (also in EE
Times Asia and SOCcentral) |
| 17 November 2011 |
Liquid
could power and cool mobile supercomputers
(New Scientist, via Electronics Weekly) |
| 14 November 2011 |
Building
3D-ICs: Tool Flow and Design Software (part 1 of 2)
(EE Times) (also in EE
Times Asia and Design
& Reuse) |
| October 2011 |
Biting
Into the New Silicon Sandwich
(EE Times Confidential) |
| 11 October 2011 |
Perfecting
the 3-D chip
(EE Times) |
| 20 September 2011 |
3-D
IC panel – CICC
(Media and Entertainment Technologies) |
| 22 July 2011 |
Thin
Film Polymer Apps from the 2011 ECTC; Tezzaron 3D Activity
(Insights From the Leading Edge) |
| 22 July 2011 |
Ten
Custom 3D-ICs from Tezzaron
(Tezzaron press release) |
| 9 July 2011 |
Elpida
and MOSIS Ready for 3D IC ; TSV Going “Where the Sun Don’t Shine”
(Insights From the Leading Edge) |
| 16 June 2011 |
Invited
Talk at the 3D satellite workshop at the TIPP2011
(MonolithIC blog) |
| 9 June 2011 |
EDA
tools pave path to 3-D ICs
(EDN) |
| 3 June 2011 |
Mentor
Graphics Works With Tezzaron and MOSIS on 3D-IC Prototyping Service
(Mentor press release) picked up by 4Traders,
Ad
Hoc News, AlphaTrade
Finance, Bradenton,
Business
Wire, Centre
Daily Times, Chip
Estimate, Congoo,
EDA
Café, EE
Herald, ElectroIQ,
Elektronik
Informationen, Finanzen, FinanzNachrichten,
FreshNews, Global
Print Monitor, GNT, Green
Technology World,
iStockAnalyst, Live-PR,
Morningstar,
NewsBlaze, PC's
Semiconductors Blog, Reuters,
Seeking
Alpha, Sensors,
StreetInsider, Sys-Con, The
Street,
TMC,
Traders
Huddle, Virtual-Strategy,
Web2.0 Journal, WebWire, Welt
Online,
World
News Network,
Yahoo!Finance,
and other news sites and blogs. |
| 14 April 2011 |
Tezzaron
Reports Outstanding 3D Success at ISPD
(MonolithIC 3D) |
| 13 April 2011 |
ISPD
spots 3-D, maskless-lithography trends
(EE Times) |
| 18 February 2011 |
Micron
reveals “Hyper Memory Cube” 3DIC Technology
(i-Micronews) |
| 29 January 2011 |
3D
Highlights at the RTI 3D ASIP Part 1
(Insights From the Leading Edge) |
| 3 January 2011 |
Outlook
and Trends 2011: A Perspective
(SMT Magazine) |
