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Newspaper and industry articles on Tezzaron® (and/or Tachyon) are listed in reverse chronological order:
|
Date
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Headline
|
|
27 Dec. '04 |
"3D Chips: Pro and Con"
(Rostov, in Russian), picked up by Russian publications
besm-2000,
iXBT,
Aspark, 7Wolf, UA-sIT |
|
23 Dec. '04 |
Press release:
3D Semiconductors Poised for Revolution;
published by
Silicon Strategies
as "Six 3D designs precede 90% power-saving claims from Tezzaron";
picked up by Wall Street & Technology,
Electronic Business Asia,
Automotive Design Line,
EE Times China,
51 Project (China),
Science
News |
|
22 Dec. '04 |
RF applications will follow the 3D Interconnect path... (RFDesign), referenced by
Defense Electronics |
|
20 Dec. '04 |
The ups and downs of three-dimensional circuits
(Silicon Strategies) -- Identified as one of their
Top Ten Stories of 2004; picked up by
Bank Systems & Technology,
Wall Street & Technology,
Silicon IP Exchange,
SINA (Hong Kong), Traders'
Corner (Norway), and by Chinese publications ESM China,
c|net,
CSIP,
Lodestar, computer.online, etime, China Electronic Material |
|
6 Dec. '04 |
Press Release:
Speedy Processor Has Memory "Upstairs"
(for general press) and
Press Release:
Third Dimension Triples Processor Speed
(for technical publications); published by
Silicon Strategies (EE Times) as "Tezzaron debuts 'super-8051' chip with 3D technology";
picked up by FSA,
Wall Street & Technology,
Bank Systems & Technology, Elektronik i Norden,
EE Times Taiwan, and by Chinese publications etime,
51 Project,
IEE China, Electronic World,
CSIP,
EE Times China,
embed-mcu
|
|
30 Nov. 04 |
High-rise circuitry lures chip makers
(EE Times) Picked up by Silicon Strategies,
EE Times Taiwan,
Memory Digest, NewsTrove,
Silicon IP Exchange, and by Chinese publications
EE Times China,
CSIA, CSIP, etime,
China IC net
|
|
29 Nov. '04 |
3D Interconnect Gets Real
(Wafer News and Solid State Technology) |
|
22 Nov. '04 |
Press Release:
Tezzaron Launches RAM in a New Dimension, picked up by
Semiconductor Reporter. |
|
19 Nov. '04 |
MagnaChip, Tezzaron form partnership for 3D chips
(Silicon Strategies/EE Times), picked up by
Silicon Strategies Newsletter, Legit
Reviews, DigiTimes,
Science News,
Packaging Today, SemiAcademy (Korea), phoenixJP.News (France), Lodestar (China),
CSIP (China), CSIA (China), CNe Buyer (China), CVIA (China),
Stor-Age,
EE Times China,
EE Times Taiwan
(logins required for EE Times). |
|
10 May '04 |
Press Release:
Tezzaron Wins $1M in Purchase Orders
|
|
26 April '04 |
Tech firm's stacked chips zip to market
(Crain's Chicago Business - login required) |
|
15 April '04 |
3D Interconnect Technology Coming to Light
(Electronic News) Six
paragraphs about Tezzaron are under
the subheading "Starting Up on the 3D Frontier"
picked up by ACM
news service, EinNews
(Germany), Australian Microelectronics Network |
|
14 April '04 |
Press
Release: Tezzaron Announces Commercial 3D
ICs
picked up by Silicon
Strategies, SemiAcademy, Daily Herald |
|
November '03 |
Semiconductor Investment and the Future
(Gilder Technology Report) Tezzaron receives favorable
notice under "Consequences" near
the bottom of page 3. |
|
November '03 |
New Memory Technology Promises Top Speeds
(Electronic Products) |
|
Sept. '03 |
Wafers Stack on Copper Super-Vias (SolidState Technology)
(Headline and story are about half-way down the page) |
|
28 August '03 |
Tezzaron delivers challenge to SRAM, DRAM (EBN)
picked up by
Electronics Supply & Manufacturing
|
|
25 August '03 |
Tezzaron Prototypes Pseudostatic Memory (
EE Times)
picked up by
EET Asia,
physics.surfwax.com |
|
18 August '03 |
Press Release:
New Memory Technology is World's Fastest, picked up by
Silicon Strategies,
EE Times,
EETimes IP/SoC Newsletter,
Design and Reuse, TechNewsWorld,
EE Design,
CommsDesign,
The Work Circuit, Today's Science News, EE Times UK, EE Times Taiwan;
Finland:
Prosessori;
Belarus:
KB Online, "Zhelezniy";
China:
CCW, China Semiconductor Industry Association,
Electron.Cetin, ETIRI, EE Times China;
Russia:
Compulenta,
Computerra,
Inforser,
Ak-Cent Microsystems,
DELFI,
Alta Plus,
Business Online,
Saturn-Plus,
Roscomputer,
XXP-Design, Crosna Space Communications,
Caspian World News,
Talk.Mail/Forum,
ITInfo, PCSamara,
IVEN Computers,
RussianPhiladelphia,
F-Center, PCHard,
HomePC,
Ferra, iBusiness, Rostov,
CPrice Info, EZPC,
TechnoStyle,
ProComputer Hotline,
GoldSoft,
Computer News,
ArtCom, XKP;
Ukraine: Alser MyComp, Gazeta 2000, Corason,
Allintel;
Latvia:
digital times,
AK-Cents Microsystems;
Korea: EE Times Korea, iCON, ECRC, ICAT;
Lithuania:
Takas;
Kazakhstan:
Computers;
Moldova:
NewsGate;
Germany: FinanzNachrichten; and others. |
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24 July '03 |
Press Release:
Tezzaron Moves to Provide 3-D Chips, Stacks, Services
|
|
29 June '03 |
Press Release:
Another Giant Step Toward 3-D Silicon, picked up by
Silicon Strategies,
EE Times, Science News,
China Semiconductor Industry Association,
CCW (China),
EE Times China (requires login),
EE Times Korea (requires login),
EE Times Taiwan (requires login),
FEDOnline (Japan),
Hardburg (Russia),
F-Center (Russia),
Inovacao Tecnologica (Brazil) |
|
7 Feb. '03 |
Press Release:
3-D Stacking Reaches New Heights, picked up by
Design And Reuse,
Silicon Strategies,
CommsDesign,
EE
Times, EE
Times UK, Electronics
Times
|
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Other articles:
Copyright © 2003-2008 Tezzaron® Semiconductor. All rights reserved.
Revised: January 25, 2008
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