Tezzaron® Semiconductor is the world leader in 3D-ICs.
We specialize in 3D wafer stacking and TSV processes,
cutting edge memory products,
and wide-ranging collaborations. In 2004 Tezzaron demonstrated the world's first successful wafer-stacked 3D-ICs
with TSV, including microprocessors,
sensors, and SRAM devices.
Since that time the company has worked with dozens of customers to create
3D-ICs for prototyping and commercialization. The company has produced
extremely fast memory prototypes
and builds memory devices for both
standalone and stacked applications.
In the near term, Tezzaron will:
existing partnerships with industry, academia, and government to
create groundbreaking new 3D-ICs
our 3D technology to a wider pool of customers
our memory components to high volume production
We invite you to explore our company by using the buttons and links at left and right.
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