About the Company:
Tezzaron®
Semiconductor
specializes in high-speed memory products, 3D wafer stacking processes, 3D
memory elements, and other innovations that propel the semiconductor industry toward
higher performance and greater profitability. The company has produced extremely
fast memory prototypes and is now building SRAM
replacement parts with standard interfaces. Tezzaron has also demonstrated the world's first
successful wafer-stacked 3D ICs, including stacked microprocessors,
stacked sensors, and stacked SRAM
devices.
In
the near term, Tezzaron will:
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Offer
high-end memory chips with our blazingly fast 3T-iRAM™
technology, out-performing all other memory technologies.
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Spearhead
the industry's move to 3D integrated circuits with our FaStack®
technology, integrating elements vertically into fast, dense,
low-power one-chip solutions.
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Continue
to bring cutting edge products to
market, creating
and patenting ways to improve the speed, density,
and reliability of electronic devices.
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We invite you to explore our
company by using the buttons and links at left and
right.
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More about the company:
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