3D-IC Alliance
(Tezzaron is a founding member)
JEDEC Solid State Technology Association
(Tezzaron is a member; Tezzaron's CTO
is a committee vice-chairman)
CMC Microsystems
(collaboration to provide MPW services)
Micro Magic, Inc.
(collaboration to develop 3D tools)
CMP Multi-Project Circuits
(collaboration to provide MPW services)
The MOSIS Service
(collaboration to provide MPW services)
Singapore Economic Development Board
(Innovative Development Scheme partner)
R3Logic, Inc.
(collaboration to develop 3D tools)
EV Group
(Memorandum of Understanding for
aligner/bonder tool endorsement and pricing)
SVTC Technologies
(agreement for manufacturing)
GLOBALFOUNDRIES
(collaboration to manufacture 3D-enabled wafers)
Timension, Inc.
(Ongoing partnership to
develop 3D solutions)
Institute of Electrical and
Electronics Engineers
(Several Tezzaron employees are members)
Ziptronix Inc.
(Letter of Intent for Mutual Support)
Institute of Microelectronics
(Joint Development Program partner; Tezzaron/Tachyon
is listed as an "Incubation Success Story")
Copyright © 2002-2010 Tezzaron® Semiconductor. All rights reserved. Revised: July 12, 2010
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