Industry Alliances

3D-IC Alliance
(Tezzaron is a founding member)

INFIERI
"Intelligent Fast Interconnected and Efficient Devices for Frontier Exploitation in Research and Industry"
(Tezzaron is an associated partner)

CMC Microsystems
(collaboration to provide MPW services)

Magma Design Automation
(collaboration to develop 3D tools)

CMP Multi-Project Circuits
(collaboration to provide MPW services)

Micro Magic, Inc.
(collaboration to develop 3D tools)

Singapore Economic Development Board
(Innovative Development Scheme partner)

The MOSIS Service
(collaboration to provide MPW services)

eSilicon
(collaborative agreement)

Novati Technologies

EV Group
(Memorandum of Understanding for
aligner/bonder tool endorsement and pricing)

R3Logic, Inc.
(collaboration to develop 3D tools)

GLOBALFOUNDRIES
(collaboration to manufacture 3D-enabled wafers)

International SEMI Standards
(Tezzaron employees are task force members)

Honeywell Microelectronics
(collaboration to manufacture radiation-hardened 3D-ICs)

SVTC Technologies
(agreement for manufacturing)

Institute of Electrical and
Electronics Engineers
(several Tezzaron employees are members)

Timension, Inc.
(ongoing partnership to
develop 3D solutions)

Institute of Microelectronics
(agreement for research collaboration)
2.5D Through-Silicon Interposer Consortium
(Tezzaron is a member)

Ziptronix Inc.
(Letter of Intent for Mutual Support)

See also: Related Papers and Presentations

Copyright © 2002-2013 Tezzaron® Semiconductor. All rights reserved. Revised: March 28, 2013