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Industry Alliances

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Logo, 3D-IC Alliance
3D-IC Alliance

(Tezzaron is a founding member)
INFIERI
"Intelligent Fast Interconnected and Efficient Devices for Frontier Exploitation in Research and Industry"
(Tezzaron is an associated partner)

 

Logo, CMC
CMC Microsystems
(collaboration to provide MPW services)
Logo, Magma
Magma Design Automation
(collaboration to develop 3D tools)

 

Logo, CMP
CMP Multi-Project Circuits
(collaboration to provide MPW services)
Logo, Micro Magic
Micro Magic, Inc.
(collaboration to develop 3D tools)

 

Logo, EVG
Singapore Economic Development Board
(Innovative Development Scheme partner)
Logo, MOSIS
The MOSIS Service
(collaboration to provide MPW services)

 


eSilicon
(collaborative agreement)

Novati Technologies

 

Logo, EVG
EV Group
(Memorandum of Understanding for
aligner/bonder tool endorsement and pricing)
 
Logo, R3Logic
R3Logic, Inc.
(collaboration to develop 3D tools)

 

Logo, GLOBALFOUNDRIES
GLOBALFOUNDRIES
(collaboration to manufacture 3D-enabled wafers)


International SEMI Standards

(Tezzaron employees are task force members)

 


Honeywell Microelectronics
(collaboration to manufacture radiation-hardened 3D-ICs)
Logo, SVTC
SVTC Technologies
(agreement for manufacturing)

 

Logo, IEEE
Institute of Electrical and
 Electronics Engineers

(several Tezzaron employees are members)
Logo, Timension
Timension, Inc.
(ongoing partnership to
develop 3D solutions)

 

Logo, IME A*Star
Institute of Microelectronics
(agreement for research collaboration)
2.5D Through-Silicon Interposer Consortium
(Tezzaron is a member)
Logo, Ziptronix
Ziptronix Inc.
(Letter of Intent for Mutual Support)

 

See also: Related Papers and Presentations

Copyright © 2002-2013 Tezzaron® Semiconductor. All rights reserved. Revised: March 28, 2013
 

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