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Tezzaron's Papers and Publications

 

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These documents use the Adobe® Acrobat® portable document format (pdf).
To download a free copy of the Reader®, go to the Adobe® site:  www.adobe.com

 
bullet3D Integration: New Opportunities for Speed, Power and Performance -- A presentation from the 3D-IC Summer School in Buenos Aires (2012) (6.6 MB)

bullet3D-ICs and Integrated Circuit Security -- A white paper (2008) (1.27 MB)

bullet3D Super-Via for Memory Applications -- A presentation from the 2007 Micro-Systems Packaging Initiative Workshop (1.36 MB)
Note: The demo video referenced on page 16 is available here.

bullet3-D Power Savings -- A discussion (2007) (435 KB)

bullet Techniques for Producing 3D ICs with High-Density Interconnect -- A presentation from the 2004 VLSI Multi-Level Interconnection Conference (VMIC) (4,052 KB)

bulletSoft Errors in Electronic Memory -- A white paper (87 KB) (updated January 2004)

bulletDRAM Pricing -- A white paper (2002) (1.6 MB) 

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Copyright © 2002-2012 Tezzaron® Semiconductor. All rights reserved. Revised: October 22, 2012
 

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