Papers and Publications

These documents use the Adobe® Acrobat® portable document format (pdf).
To download a free copy of the Reader®, go to the Adobe® site: www.adobe.com

	3D Integration: New Opportunities for Speed, Power and Performance -- A presentation from the 3D-IC Summer School in Buenos Aires (2012) (6.6 MB)
	3D-ICs and Integrated Circuit Security -- A white paper (2008) (1.27 MB)
	3D Super-Via for Memory Applications -- A presentation from the 2007 Micro-Systems Packaging Initiative Workshop (1.36 MB) Note: The demo video referenced on page 16 is available here.
	3-D Power Savings -- A discussion (2007) (435 KB)
	Techniques for Producing 3D ICs with High-Density Interconnect -- A presentation from the 2004 VLSI Multi-Level Interconnection Conference (VMIC) (4,052 KB)
	Soft Errors in Electronic Memory -- A white paper (87 KB) (updated January 2004)
	DRAM Pricing -- A white paper (2002) (1.6 MB)

	About Tezzaron®
	Industry Alliances
	Tezzaron® in the News
	Management
	Board of Directors
	Consultants & Professional Services
	Photo Album