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Memory Devices, 3D ICs, Advanced Technologies


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FaStack®
   3D Wafer Stacking

3T-iRAM™
   Fast Memory Cells

Bi-STAR™
   Self-Test and Repair

TufFRAM®
   Non-Volatile Memory

 

3D-IC Industry Summary

MEMORY ICs:

   SRAM Replacements:

      NBT, DTR, and QTR interfaces

      Compatible with:
        NtRAM*, ZBT*, NoBL*,
        DDR, DDRII, DDRII+*,
        QDR*, QDRII*, QDRII+*

   FaStack® 3D Memory:

      3D Stacked SRAM

      3D Stacked DRAM:

         DDR

         DDR2

   TufFRAM®
OTHER ICs:

   3D Stacked Microcontroller
      with SRAM

   Embedded Microcontroller

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Copyright © 2005-2008 Tezzaron® Semiconductor (previously Tachyon Semiconductor). All rights reserved.  Revised: July 02, 2008
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