The Leo FaStack® is an integrated circuit that performs as a DDR SDRAM, compatible with the JEDEC DDR I standard, and incorporating features above and beyond that standard. It acts as a high-speed, CMOS, dynamic random-access memory containing 1,073,741,824 bits, configured internally as a quad-bank DRAM. It achieves high-speed operation through a double-data-rate (DDR) architecture - that is, a 2n pre-fetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. Each read or write access consists of a single data transfer (two data words in one clock cycle) at the internal DRAM core, and two corresponding data transfers (each being one data word in one-half clock cycle) at the I/O pins. A bidirectional data strobe is transmitted externally along with each byte of data for use in data capture at the receiver. Each strobe signal is edge-aligned and transmitted by the DDR SDRAM for reads; it is center-aligned and transmitted by the memory controller for writes. The 64-bit Leo FaStack has eight data strobes, one for each byte; the 16-bit version has 2 data strobes; the 8-bit and 4-bit versions use a single data strobe. The Leo FaStack operates from a differential clock. Commands (address and control signals) are registered at every positive edge of CK. Input data are registered on both strobe edges; output data are registered to both edges of the strobe as well as to both edges of the clock. Read and write accesses are burst oriented; each access starts at a selected location and continues for a programmed number of locations in a programmed sequence. An access begins with the registration of an ACTIVATE command, which is then followed by a READ or WRITE command. In all three commands, the bank address bits define the bank to be accessed; the address bus bits registered with the ACTIVATE command define the row to be accessed; the address bus bits registered with the READ or WRITE command define the starting column for the burst access. Read or write bursts may be programmed for a length of 2, 4, or 8 locations. Enabling the Auto-Precharge function provides a self-timed row precharge that is initiated at the end of the burst access. The pipelined multi-bank architecture hides row precharge and activation time by allowing concurrent operation, thereby providing high effective bandwidth. Available modes include Auto-Refresh and Power-Down. All inputs are compatible with the JEDEC SSTL_2 standard; outputs are compatible with the JEDEC SSTL_2, Class II standard. For more information, including pricing and availability, contact:
|
| FaStack® Memory | |
| FaStack® Technology | |
| Bi-STAR™ Technology |
|