Tezzaron's Patented Technologies:
®
FaStack - Wafer stacking and die stacking technology
with TSVs for 3D-IC devices
®
Bi-STAR - Built in self-test and repair circuitry for continuous error
detection and recovery
®
3T-iRAM - Ultra-fast 3T memory cell with current-sensing circuitry
for SDRAM with pseudo-SRAM performance
